CUSTOM MODULE
Powerex has addressed the need for application specific custom power modules with its Customer Power Products Group. Dedicated specifically to the task of providing cost effective solutions to complex semiconductor applications, Powerex brings its formidable experience and data base of knowledge to bear on chip manufacturing, electronic materials, and design/engineering techniques.

Powerex's Custom Power Modules employ the performance proven features of the standard Mitsubishi module product line. Soldered-down and wire bonding fabrication and compression bonded encapsulation (CBE) of SCR/Diode elements offer increased switching speeds, lower losses, more efficient cooling, and higher power handling capabilities.

Customizing an electronic package involves the precise selection of many components. High power diodes, SCRs, transistors, Darlington transistors, IGBTs, and MOSFET technology, along with the selection of driver circuits, isolated materials, packages and terminals are key elements in Custom Packaging design. Powerex has continuing access to the most advanced circuit and chip design through its alliance with Mitsubishi Electric Corporation and its own on-site design/engineering chip Wafer Fabrication facilities.

DIAMOND POWER
Powerex and its business partner, Mitsubishi Electric Corporation, have pioneered multi-element packaging of semiconductor chips for more compact power systems, the simplification of the mechanical mounting to components, the reduction of circuit parts count, and inventory control. Multi-component packaging combines transistors, thyristors, diodes and other elements into a cost effective, electrically isolated compact module that handle a specific circuit function.

The continuing advancement of power module technology is the direct result of a growing demand for higher operating frequency and switches that have more durability and integrated functions. Powerex introduced the Insulated Gate Bipolar Transistor (IGBT) in answer to this growing demand. IGBT technology is also the foundation of a family of intelligent power modules that feature integrated control and protection logic.

To ensure the continued lead in module technology, Mitsubishi Electric has a continuous technology effort, which has resulted in the development of a new proprietary trench gate MOS process. This new process is being applied to a new family of discrete MOSFET transistors and the next generation IGBT modules.

In order to exceed customer expectations in terms of delivery and cost of ownership, Mitsubishi Electric and Powerex continue to make investments in design, development, production facilities, logistics operations, and application engineering support.

RECTIFIERS/THYRISTORS
A pioneer in high power applications, turning ideas into cost-effective, practical products, Powerex leads the way in high power rectifier and thyristors with a broad line of stud and disc devices in various sizes and construction styles. A continuing investment in high power has significantly advanced silicon technology and packaging, bringing to market the newest generation of semiconductor devices. Advanced generations of standard rectifiers, fast recovery rectifiers, phase control SCRs and inverter-grade SCRs are offered in hermetically sealed compression bonded packaging.

Powerex complements its device technology with products such as rectifier/ thyristor modules, Pow-R-Briks, and assemblies with water or air-cooled heat sinks, providing cost-saving installation and ease of use.

Powerex's rectifier and thyristor product line offers a constant source of new technology, product development, and the capacity to manufacture quality product on a consistent, reliable basis.

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